超大规模集成电路VLSI设计导论 (2022秋 李镇宜) - 盘搜天堂 - 搜索网盘资源的天堂！

• file:说明.txt
• file:18. Supplement.pdf
• file:17. Design for Skew.pdf
• file:15. Package, Power, and IO.pdf
• file:13. CAMs, ROMs, and PLAs.pdf
• file:12. SRAM.pdf
• file:11. Datapath Functional Units.pdf
• file:09. Sequential Circuits.pdf
• file:08. Circuit Families.pdf
• file:补充05-HW2 (Layout).mp4
• file:补充04-CMOS Design Knowhow & Logic Synthesis.mp4
• file:补充03-CMOS Technology & Layout Tool Intro.mp4
• file:补充02-Hspice Demo.mp4
• file:补充01-Introduction to Hspice Tool.mp4
• file:Lec13-Package, Power, and IO (cont.) & Design for Low Power & Design for Skew.mp4
• file:Lec12-Design for Testability & Package, Power, and IO.mp4
• file:Lec11-SRAM (cont.) & CAMs, ROMs, and PLAs.mp4
• file:Lec10-Datapath Functional Units (cont.) & SRAM.mp4
• file:Lec09-Sequential Circuits (cont.) & Adders & Datapath Functional Units.mp4
• file:Lec08-Circuit Families (cont.) & Sequential Circuits.mp4